OEM / ODM TEC Cooling Assemblies
Custom TEC and Peltier cooling assemblies for compact OEM medical, laboratory, aesthetic, analytical and industrial equipment.
Product Series
Custom TEC cooling modules, Peltier cooling assemblies and semiconductor refrigeration system configurations for different cooling capacities, installation spaces and OEM equipment structures.
Three standard cooling capacities plus a custom multi-fan configuration.
Compact custom TEC / Peltier cooling module for equipment with limited installation space and localized cooling requirements.
Key Technical Data
| Model | BL150-24-7 |
|---|---|
| Rated Voltage | DC24V |
| Rated Current | ≥7A |
| Dimensions | 162.5 × 184 × 178 mm |
| Accuracy | ±0.1°C |
| Weight | 3 kg |
Balanced TEC and Peltier cooling assembly for beauty aesthetic device cooling solutions, handheld systems, and compact equipment integration.
Key Technical Data
| Model | BL250-12-20 |
|---|---|
| Rated Voltage | DC12V |
| Rated Current | ≥20A |
| Dimensions | 276.6 × 149 × 148 mm |
| Accuracy | ±0.1°C |
| Weight | 5 kg |
Fan-cooled thermoelectric / Peltier cooling module designed for larger contact areas, compact TEC cooling systems, and stronger hot-side heat removal.
Key Technical Data
| Model | BL300-24-14 |
|---|---|
| Rated Voltage | DC24V |
| Rated Current | ≥14A |
| Dimensions | 274.6 × 153 × 138 mm |
| Accuracy | ±0.1°C |
| Weight | 5 kg |
Project-specific OEM Peltier cooling system developed around your thermal target, device structure, and production plan.
Key Technical Data
| Model | Non-standard OEM design |
|---|---|
| Rated Voltage | DC12V / DC24V / custom |
| Rated Current | Designed by thermal load |
| Dimensions | Custom to installation space |
| Accuracy | Target-based control |
| Weight | Project-specific |
Compact air-to-air thermal management for medical, laboratory, analytical, industrial and other OEM equipment.
Designed as a compact solid-state air-to-air thermal-management module for OEM equipment that needs localized or enclosed-space temperature control. Separated cold-side and hot-side airflow paths transfer heat without mixing the two air circuits, while compressor-free and refrigerant-free operation supports clean, quiet and maintenance-friendly integration. Typical applications include medical and aesthetic devices, laboratory instruments, analytical equipment, industrial control cabinets and other compact electronic systems; mounting interfaces, airflow direction, DC voltage, fan configuration and control strategy can be adapted to the project.
Key Technical Data
| Cooling capacity | 100W / 150W / 250W / 300W / 500W |
|---|---|
| Voltage options | DC12V / DC24V / DC48V |
| Temperature-control accuracy | ±0.1°C |
| Cooling medium | Air |
| Noise level | 30–50 dB (custom acoustic design available) |
| Fan configuration | Single or dual fan |
At an ambient temperature of 30 °C, a 100 W air-cooling module can cool a sealed enclosure with a nominal internal capacity of 15 L from 30 °C to 6 °C within 20 minutes under the stated no-load reference condition.
Actual cool-down performance varies with enclosure capacity, insulation, enclosure construction, heat load, installation and operating conditions. Final capacity and configuration must be evaluated for the real application.
Technical Specifications
Important Design Basis
This table provides technical data for our standard TEC cooling modules. The standard cooling modules are designed for a target liquid cooling temperature of 25°C, with cooling capacities of 150W, 250W, and 300W. If customers require cooling the liquid to below 25°C, they need to provide specific application requirements, and we will design the cooling capacity based on the actual liquid temperature difference.
Note: Actual performance depends on TEC configuration, heat dissipation design, ambient temperature, cold-side structure and operating conditions.
Dimension Drawings
Reference drawings for standard 150W, 250W and 300W TEC cooling modules. Final mechanical interface can be customized for the target equipment.
Standard dimensional drawing
Standard dimensional drawing
Standard dimensional drawing
Accessories
Optional accessories and TEC Cooler elements can be combined with our semiconductor cooling modules to build a complete liquid circulation system for equipment-level integration.
Digital temperature control module used with TEC cooling assemblies to manage target liquid temperature, sensor feedback, and system operation.
Compact circulation pump for driving coolant through the TEC cooling module, cold-side interface, water tank, and connected equipment loop.
Coolant reservoir designed to work with the pump and TEC cooling module, helping form a stable water circulation system for equipment integration.
High-performance TEC Cooler element for custom thermoelectric cooling modules and compact embedded temperature control systems.
Applications
Built for manufacturers and system integrators that need compact TEC cooling systems, Peltier cooling assemblies, embedded temperature control solutions, and reliable cooling assemblies inside their own devices.
Compact thermoelectric cooling modules for medical device cooling solutions that require stable liquid cooling, precision temperature control, and reliable cold-side integration.
Beauty aesthetic device cooling solutions for IPL, DPL, OPT, laser hair removal, and post-treatment cooling systems.
Laboratory instrument cooling systems for localized cooling, sample cooling, and compact temperature control in benchtop and embedded instruments.
OEM thermal management solutions and thermoelectric cooling modules for electronics, inspection equipment, and compact industrial systems.
Why Choose Us
We support equipment teams with custom thermoelectric cooling assemblies, project-specific adjustments, and production-oriented OEM/ODM cooperation.
Customization
Our engineering team can adjust the cooling assembly design based on thermal requirements, installation space, device structure, and production requirements.
Technology
When current passes through a TEC element, one side absorbs heat as the cold side while the other side releases heat as the hot side. The complete semiconductor cooling assembly uses heat sinks and cooling fans to remove hot-side heat and maintain practical cooling performance.
Actual performance depends on TEC configuration, heat dissipation design, ambient temperature, cold-side structure and operating conditions.
OEM / ODM Process
About Arkmex
Arkmex Technology focuses on high-performance TEC cooling modules, custom thermoelectric cooling assemblies, semiconductor cooling systems, and embedded temperature control solutions for advanced equipment manufacturing. We work as an engineering partner for customers who need compact, precise, and reliable thermal management inside their own products.
Our capabilities cover custom TEC cooling module configuration, mechanical structure design, heat exchange design, drive circuit development, process control, and reliability verification. By combining technical depth with responsive project support, we help OEM/ODM customers reduce integration risk and move from sample validation to stable batch production.
Precision
Reliability
Collaboration
Design
Sampling
Testing
Batch Production
Knowledge Center
Engineering notes about custom thermoelectric cooling assemblies, Peltier cooling systems, TEC cooling modules, semiconductor cooling systems, compact TEC cooling systems, liquid cooling loops and OEM thermal management solutions.
Explore industrial precision temperature control challenges, TEC cooling design, thermal paths, OEM integration and custom cooling assemblies.
FAQ
A thermoelectric cooling module uses a TEC or Peltier element to move heat from one side of the assembly to the other when current passes through it. In a complete TEC cooling assembly, heat sinks and fans remove hot-side heat to support stable cooling performance.
Yes. Cooling capacity, module size, fan quantity, cold-side structure, heat sink design, mounting interface, voltage, cables, connectors, controller options, and housing materials can be evaluated based on your equipment design.
Common applications include medical device cooling solutions, beauty aesthetic device cooling solutions, laboratory instrument cooling systems, compact industrial equipment, and localized temperature control modules.
Yes. We support requirement evaluation, OEM thermal management solution design, sample development, testing feedback, and batch production for OEM/ODM equipment customers.
The cold side absorbs heat while the hot side releases heat. If hot-side heat is not removed efficiently by heat sinks and fans, the cooling performance of the complete assembly will be reduced.
Useful information includes application, device structure, target temperature, ambient conditions, available installation space, voltage, control method, expected quantity, and any drawings or reference images.
Yes. TEC cooling modules are commonly used in beauty and medical aesthetic devices where compact cold-side cooling, customized mounting, and stable equipment integration are required.
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